IBM developed the \"optical wiring printed board\" light SiP can be installed directly -- silicon resin-Iota

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News > Dynamic industry > IBM developed the \"optical wiring printed board\" light SiP can be installed directly -- silicon resin

IBM developed the \"optical wiring printed board\" light SiP can be installed directly -- silicon resin

America IBM company of Switzerland Zurich Institute developed the "optical wiringprinted board (opticalprintedcircuitboard)", can be directly installed in electric modeoptical SiP includes microprocessor, work (system in a package). The Institute ofinternational society "USA Losangeles at the optical communication technology of OFC2015" published an article entitled "SiliconPhotonicsfortheDatacenter" speech,introduced the relevant technology.

Here refers to the light SiP said on the silicon chip using silicon photonic technology manufacturing or by pasting technology manufacturing optical transceiver components,optical waveguide and optical modulation circuit in electric mode to work with themicroprocessor with integrated into SiP. The input and output signal of optical SiP: most of the light signal. In addition to IBM, in Japan by government to the composition of theteam is SiP development of this kind of structure light.

However, technology development and wiring between this light SiP to achieve through the light did not progress. Tried the method mainly has two kinds. One is in the form of broadband optical fiber and the optical waveguide end mounting connector, and the connector is directly connected with the optical SiP. But the light wiring and optical wiringor optical wiring with fiber is very difficult to realize high precision alignment axis direct connection. Even if the connection is successful, the coupling loss is very big, and the connector size is large, it is difficult to improve the wiring density. Increase in the number of wiring, fiber and broadband in the substrate complex, will occupy a larger space.

Another method is in the printed wiring is formed on a substrate, with the optical waveguide substrate is parallel, through the concave point connected with the optical waveguide "(Pits)", the exchange of optical signal and optical SiP. The optical signal in the optical waveguide bending direction at right angles to the method in the optical waveguide configuration 45 degrees inclination micro mirror (45 degree mirror) methodand the use of diffraction grating instead of reflecting mirror method. However, these methods have freedom of choice and location of the SiP installation position tolerances ofsmall, low scalability issues.

The optical wiring printed board is to reduce or eliminate the optical SiP through opticalconnection face these issues. Specifically, the light of printed wiring substrate is in flexibleprinted wiring board is made of high density form consisting of a plurality of UV curablesilicone single-mode optical waveguide.

This level, there was also the prototype has reached. And this, in connection with IBMlight SiP printed using the "spot size converter optical wiring in the optical waveguidesubstrate (SSC)". SSC is the use of micro optical waveguide and coarse optical waveguide coupling components when. SSC by making the micro optical waveguide core wire tapering until the end, converting optical signals with a low loss of the beam width.Generally need to calibrate the optical axis.

This time, the ball grid array IBM instead of working with electrical mode IC (BGA), optical waveguide end in the light of SiP in the formation of multiple SSC. Only need to make these SSC and optical wiring optical waveguide heart line printing substrate near, in the light of SiP and optical wiring printed board between the optical signal transmission.Although the waveguide optical SiP and substrate is substantially parallel configuration,but without the alignment of optical axis. Because the use of optical waveguide was very close, part of the light will be transferred to the next on the waveguide properties. IBM willthis called "adiabaticopticalcoupling (heat insulation type optical coupling)".

IBM pointed out, so there is no need for wiring in the printed substrate formed "concave point", a 45 degree mirror and a diffraction grating, can be in any SiP installation position of optical substrate. The actual installation of optical SiP found, light SiP and light wiringprinted board between the established more than 50 channels. Loss of connection to 0.8dB only. In addition, relative to the + 2 u m positioning bias, loss less than 0.5dB.