Comparative analysis of common characteristics of electronic potting-Iota

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Service > Comparative analysis of common characteristics of electronic potting

Comparative analysis of common characteristics of electronic potting

Electronic potting is a for potting electronic components, power supply, electronic products, the protective glue, after use can provide the best stress demand for electronic devices and ensure that components do not affect each other, avoid components is directly exposed to the air, to prevent components from corrosion environment, improve the service life of components, or to be waterproof, dustproof and heat conduction effects.

Electronic potting materials usually have three types of material are: epoxy resin, silicone and polyurethane, electronic pouring sealant applied in different components will be different, then how to choose a need to use the potting material??

You may consider the following points:

1, the encapsulated to withstand the temperature (if the bear is about 100 DEG C, then using epoxy resin and polyurethane are can, and silicone is can withstand high low temperature of - 60 to 200 DEG C)

2, the anti cold ability changes (the best followed by polyurethane, silicone, epoxy resin is the worst)

3, the coefficient of thermal conductivity (both epoxy resin and silicone has good thermal conductivity, polyurethane worst)

4, electrical and insulation resistance (the best followed by polyurethane, silicone, epoxy resin is the worst)

There are other factors to consider, such as components to withstand stress, used indoor or outdoor use, stress, whether to ask flame retardant, color and manual or automatic filling and sealing and so on.

Making electronic potting material usually choose silicone, silicone high and low temperature resistant and anti thermal shock performance is good, can bear 60 to 200 DEG C between the thermal shock and thermal conductivity is also very strong, both electrical insulation properties or resistance corona than similar epoxy resin potting glue or polyurethane potting is better because the.

Epoxy resin and silicone potting glue the two curing after has excellent electrical insulation properties, some occasions can be used interchangeably, but two types of potting material and each have advantages and disadvantages.

Epoxy resin: at room temperature with excellent electrical insulation properties, low temperature resistance, only working in the 30 to 120 DEG C, good thermal conductivity and heat dissipation performance, but resistant to outdoor ultraviolet performance is poor, aging resistance performance is poor, high hardness, resistance of thermal denaturation of energy difference, moisture-proof performance in general situation is excellent, but in the process of changes in the cold and prone to minor cracks lead to moistureproof performance becomes poor.

Silicone: at room temperature with excellent electrical insulation properties, high temperature tolerance, can work in the 60 to 200 DEG C, with excellent moisture resistance, anti alternating hot and cold resistance, resistance to outdoor ultraviolet and anti-aging ability, after curing for soft have excellent thermal conductivity and thermal performance.

One component epoxy resin sealant and two-component epoxy resin sealant, high hardness, strongshear strength. Disadvantage is that temperature is relatively poor, electrical performance is not good, made of silicone sealant silicone rubber electronic potting, including HIV-1-infection the single group silicone potting glue and double group divided into silicone sealant. Silicone sealant is usually soft and elastic. The general mechanical strength, good electrical performance, non yellowing, high thermal conductivity, excellent heat resistance. High temperature resistant inorganicglue, generally up to 500 C and 1200 C. The disadvantage is resistant to organic medium, low hardness, high shrinkage, easy to crack. Polyurethane sealant with good bonding properties, insulation performance, shrinkage of small, medium resistance generally. The disadvantage is that the heating curing (100 DEG C - 135 DEG C) and with greater toxicity, yellowing.

Potting no common characteristics and in some industries need to performance relatively good potting, but these products did not meet the product requirements. So the pouring sealant for improvement and modification is a good direction of development is with epoxy or polyurethane change of silicone, in good electrical properties, weather resistance and good based on improved physical properties.

The application of modified materials is relatively small, in the electronic technology development at the same time, potting will get rapid development. Electronic potting adhesive requirements has excellent electrical performance, insulation good; excellent mechanical properties, high strength, good elasticity; slaughter is low, good fluidity, easy to filling and sealing operation. Comprehensive above, electronic pouring sealant silicone potting material than the use of encapsulating materials of epoxy resin potting electronic more outstanding, application range is wider.