Why silicone potting material more suitable for potting electronic components?-Iota

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Service > Why silicone potting material more suitable for potting electronic components?

Why silicone potting material more suitable for potting electronic components?

Temperature resistance is only -10 ℃ ~ 120 ℃, hot and cold change process prone to small cracks, compared to epoxy potting electronic materials that can withstand the cold -60 ℃ ~ 200 ℃ between no change cracking and to maintain flexibility, affecting moisture resistant, effectively extending the life of electronic devices, poor resistance to thermal changes, high hardness after potting curing, easy maintenance of electronic equipment, the use of thermally conductive material after filling as well as good thermal modification capacity, easy to strain electronic components, after potting can effectively improve the cooling capacity and moisture resistance of electronic components, and after silicone curing electronic potting material for soft, generally apply only to the environment, no special requirements the electronic equipment inside because silicone potting material has good resistance to high temperature capability

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