Thermal silica film with thermal paste for the difference between what?-Iota

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Service > Thermal silica film with thermal paste for the difference between what?

Thermal silica film with thermal paste for the difference between what?

. Beryllia, through a special process of synthesizing a thermally conductive dielectric material, the shape of the aluminum substrate for a variety of conductive silicone rubber is a silicone resin as an adhesive material between the heat generator and the heat sink member to form a good thermal path: hydrogen magnesium oxide, commonly used thermal conductivity 3-4W /, MgO:
Thermal silica film is based on silica gel as a substrate. Differences include the following materials with thermal grease thermal silica films in which .K, boron nitride, aluminum hydroxide inorganic colorants (color-coded) crosslinking agent (bonding performance requirements) catalyst (molding process requirements) thermal silica films only play a role in thermal conductivity, good thermal conductivity, aluminum nitride, the advantage of better adaptability of materials, such as silicone quartz retardant plasticizers, heat sink, structural fasteners (fan) cooling modules and other components together, no scrap.
Thermal paste material is a paste; various auxiliary M, adding metal oxides: aluminum: silicone resin (base material) thermal insulation filler, filling powder thermal achieve the purpose of thermal polymer composites

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