Henkel Launches 14.5 W/m·K Thermal Conductive Material to Solve AI Optical Module Heat Dissipation Challenges-Iota

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News > Dynamic industry > Henkel Launches 14.5 W/m·K Thermal Conductive Material to Solve AI Optical Module Heat Dissipation Challenges

Henkel Launches 14.5 W/m·K Thermal Conductive Material to Solve AI Optical Module Heat Dissipation Challenges

Recently, Henkel has commercialized its ultra-high thermal conductive silicone-based liquid thermal interface material, Loctite TCF 14001, specifically designed for AI data center 800G–1.6T optical modules. The product uses a two-component silicone formula combined with unique filler technology, achieving a thermal conductivity of 14.5 W/m·K, leading the industry. While ensuring ultra-high heat transfer efficiency, the material has a siloxane volatile content below 100 ppm and extremely low oil seepage, preventing contamination of optical components. It also provides stable flow and high-precision automated dispensing capabilities, meeting complex operational requirements. With the surge in AI computing demand, large-scale deployment of 800G and higher-speed optical modules is accelerating. The thermal interface materials market is expected to reach 35 billion RMB in 2025 and 55 billion RMB by 2030. This product not only fills a gap in a specialized field but is also expected to expand into new energy vehicles and industrial automation, supporting heat management upgrades across related industries.

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