AI Hardware: Silicone Helps “Cool and Relieve Pressure” for Computing Power-Iota

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News > Dynamic industry > AI Hardware: Silicone Helps “Cool and Relieve Pressure” for Computing Power

AI Hardware: Silicone Helps “Cool and Relieve Pressure” for Computing Power

The explosive growth of artificial intelligence is driven by powerful hardware—AI servers and high-performance chips—but with greater computing power comes immense heat. Silicone’s superior thermal conductivity and insulation make it essential for stable AI hardware operation.
High-end AI chips now exceed 300 W in power consumption. Without effective heat dissipation, overheating can reduce performance or even burn chips. Silicone-based thermal materials solve this issue. Thermal grease and gel fill microscopic gaps between chips and heat sinks, eliminating insulating air pockets. With thermal conductivity above 3.0 W/m·K—3 to 5 times higher than conventional materials—they quickly transfer heat to cooling systems. At the same time, silicone’s outstanding insulation prevents short circuits in densely packed electronic systems.
In AI servers, silicone potting compounds encapsulate circuit boards and connectors, protecting against vibration, impact, dust, and moisture—ensuring 24/7 operation. As AI models, autonomous driving, and large-scale training continue to push computational limits, silicone will keep evolving—enhancing heat transfer and thermal stability to sustain AI’s “cool performance.”

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